Liquid Cooling

GPU clusters operating at 40–100kW per rack exceed the limits of air cooling. Our dedicated liquid cooling production facility delivers thermally validated, fully integrated AI infrastructure that’s production-ready before it reaches your data center floor.

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LIQUID COOLING BY THE NUMBERS

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reduced energy consumption

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reduction in carbon footprint

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better performance in HPC tasks

The Need for Liquid Cooling in Modern Computing

Learn how AHEAD is helping organizations adapt their infrastructure for the density demands of the future with direct-to-chip liquid cooling.

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Facility and Lab

01.
AHEAD’s Dedicated Rack Scale Integration Facility
We operate 350,000+ sq ft of purpose-built AI infrastructure production capacity — including 75,000 sq ft of dedicated rack integration and thermal deployment space — engineered for high-density AI programs at enterprise scale. We deploy complete and fully tested solutions from our facilities to yours, including the racks, servers, liquid cooling infrastructure, and networking. All engineered for reliability, resilience, and security.
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AHEAD’s Hands-On Innovation Lab
Our AI Infrastructure Validation Center benchmarks liquid cooling architectures against real production workloads before deployment to ensure your AI environment performs as designed. The Lab features both rack-scale and direct-to-chip cooling. Experience facility chiller cooling demos that simulate real-world deployment scenarios, or see side-by-side comparisons of thermal efficiency and power consumption to make data-driven infrastructure decisions. It’s your sandbox to tweak until your infrastructure meets your specific requirements.

Liquid Cooling for Enterprise Scale AI & HPC Infrastructure

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AHEAD’s Dedicated Rack Scale Integration FacilityLiquid Cooling for Performance and Reliability

Driven by the increasing need for high-power chips and servers in data center infrastructure, AHEAD’s state-of-the-art facility is designed for the complexities of direct-to-chip liquid cooled racks.
Racks of densely packed systems are optimally configured for thermal management, resulting in improved performance, reduced risk of overheating, and increased reliability of critical components like CPUs and GPUs.
Improvements in total cost of ownership are achievable through higher density, increased use of free cooling, improved performance, and improved performance per watt.

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Rack Integration for Greater Scalability and Customization

AHEAD has a dedicated AI and HPC rack integration facility for air- and liquid-cooled design, build, and deploy services.
Individual and multi-rack integrated solutions are customized to handle the computational demands for a variety of AI and HPC workloads.
Utilizing high-density server solutions that support multiple GPUs or processors within a single liquid-cooled rack significantly boosts processing power and capacity within a similar physical footprint.
Integrating the liquid cooling systems with existing facility infrastructure can enhance overall efficiency and scalability while optimizing performance to cost.

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Direct-to-Chip Liquid Cooling for Efficiency and Sustainability

The power needed to operate a full rack of high-density servers for AI/HPC workloads can be four to twelve times higher than that of an average server rack, beyond the limits of current air-based cooled data centers.
Liquid cooling has become a critical technology for maintaining electrical and thermal efficiency in these environments and to reduce the consumption of natural resources.
Direct-to-chip liquid cooling has emerged as the industry’s preferred method because liquid removes heat more effectively than air and eliminates the reliance on server fans, which also optimizes space utilization.
Direct-to-chip liquid cooled racks enable data centers to support thermal requirements without major data center restructuring, unlike the alternative immersion cooling, which requires a significantly higher investment to deploy.

AHEAD’s Hands-On Innovation Lab

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Innovation Lab with a digital twin environment enables infrastructure optimization across compute, storage, networking, and AI workloads.
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Hands-on environment to benchmark performance gains across diverse AI architectures, with support for multiple GPU and CPU configurations.
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Features both rack-scale and direct-to-chip cooling, alongside facility chiller cooling demonstrations that simulate real-world deployment scenarios.
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Empowers data-driven infrastructure decisions based on side-by-side comparisons of thermal efficiency and power consumption.

Solutions Aligned With Your Journey

AHEAD helps determine your AI opportunity, define use cases and data requirements, and set a course for AI that turns potential into an acceleration plan.